System Products

i2a Technologies provides a full complement of BGA and non JEDEC Module Systems including RoHS compliant solutions.

i2a Technologies specializes in the design, development and contract manufacturing of embedded microcontroller and other systems.  The company is one of the leading chip-on-board (COB) systems manufacturers worldwide combining SMT component assembly with IC wafer sawing and gold wirebonding.  Applications include medical device electronics, consumer products, computers and communications systems. 

By utilizing the latest technologies, most advanced equipment and highest quality standards, we provide core manufacturing services to include PCB build, box-build, final packing and delivery to end users. Using a single source supplier for all your manufacturing needs simplifies the whole process and allows you to concentrate on your core business.

Whether you are updating an existing product or introducing a new one, i2A Technologies has the ability to assist our manufacturing customers with their design and engineering requirements. We have extensive experience designing and building medical devices and consumer products.

PCB Assembly Design & Development

• Embedded software designing
  • Low power CPU applications
  • Short range inductive telemetry
  • Design of LCD based applications
• PCB layout design
  • Schematic design
  • Prototype PCB Assembly
  • Analog and digital simulation
  • PCB layout with 2-layers
• Mechanical design
  • Mold-Die Design
  • LCD Design
  • Casing Layout Design
  • Mechanical Parts Design
• Ongoing Development
  • Manufacturing technology development
  • Tester design and development
  • Failure Analysis Capability up to die level
  • Package reliability
  • Silicon design

Manufacturing Capabilities

• Surface-Mount Technology (SMT)
  • Lead-free solder paste process
  • 0402 capability
  • 0201 capability with 0.15mm inter-component spacing
  • 01005 chip capability
• Gold Wire Bonding
  • Chip-on-flex (COF)
  • Chip-on-chip (COC)
  • Chip-on-board (COB)
  • 60um bond-pad-pitch (current)
  • Multiple-die bonding (6 dice on a board)
  • High wire density bonding (400 wires a board)

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