I2A Technologies' stacked-die packaging is used to dramatically increase
packaging density and to put multi-chip functionality into a single
IC package
Stacked-die packaging allows for very efficient use of
mother-board real estate, reducing size and weight, as well as
contributing to system level cost reduction. The technology also
enables the flexibility of combining custom chips with off-the-shelf
devices to further reduce total systems cost.
Stacked-die packages are often used in products requiring
increased memory density and performance while reducing package
size. Portable electronics products such as cell phones, PDAs,
camcorders and other wireless consumer systems can benefit from the
combination of multi-chip function and small footprint.
I2A offers three basic stacked die versions of wire bonded
packages, (a) pyramid stacked die where smaller die are placed on
top of larger die, (b) same size die with a silicon spacer placed
between the two die, and (c) die with overhang where rectangular die
are placed at 90 degrees on top of each other. The die are thinned
to 8-10 mils in order to achieve maximum package heights of 1.4mm an
1.2mm. Stacked-die packages with three and more stacked chips
are also available. Below are illustrations of the basic
two-die stack versions:
