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QFP (Quad-Flat-Package) is the original surface mount package family which addresses the higher leadcounts of larger digital ICs, owing to its design using thin, fine-pitch leadframes and four-sided lead configuration. Flexible external leads provide high reliability of solder joints of mounted devices while conventional wirebond and transfer molding result in low unit costs.

Variations within the package family include the low-profile and thin (LQFP and TQFP) type with package thicknesses of about 1.4mm and 1.0mm respectively.  Thermal enhancements available include built-in heatsinks in standard QFPs and exposed die pads in L-and TQFPs, which can improve thermal resistance between the chip and the package by over 50%.

QFPs are found in PCs, consumer electronics, automotive and industrial applications, wherever such IC products as processors, controllers, logic, ASICs, graphics, DAC and many others are used.   LQFPs and TQFPs are ideal for applications such as lightweight and portable electronic products, notebook PCs, disk drives, cell phones, etc.

I2A Technoloies' QFP Families (MQFP, LQFP and TQFP) family of packages are wide ranging. The smallest package / lead count is 7x7 mm 32 leads and the largest package is 32x32mm 240 leads with the highest lead count being the 28x28mm 256 leads.
 

MQFP (Metric) Package Availability
Package x
thickness
(Footprint)

(mm)

 Lead Count Lead Pitch


(mm)		 Available Pad
size


(mm)		 Die size acceptable range(1)

(mm)		 Minimum acceptable die size for fine pitch(2)
(mm)		 Thermal package availability
14 x 20 x 2.7mm
(3.20/3.90mm)		 80 0.80 6.60 sq.- Cu 1.25 - 6.00 2.70   Both PowerPAC(TM) and
  Embedded drop-in HS options
  are available for production
100 0.65 6.60 sq.- Cu
9.10 sq.- Cu		 1.25 - 6.00
3.75 - 8.60		 2.70   Both PowerPAC(TM) and
  Embedded drop-in HS options
  are available for production
128 0.50 7.00 sq.- Cu
9.10 sq.- Cu
11.00 sq.- Cu		 1.65 - 6.50
3.75 - 8.50
5.65 - 10.40		 3.00
5.20
7.00		   Both PowerPAC(TM) and
  Embedded drop-in HS options
  are available for production
28 x 28 x 3.4mm
(3.20/3.90mm)		 128 0.80 10.50 sq.- Cu 5.25 - 9.80 7.00   Both Embedded drop-in HS and
  PowerPAC(TM) options are
  available for production
144 0.65 7.60 sq.- Cu
10.00 sq.- Cu		 2.25 - 7.00
4.65 - 9.40		 3.80
6.70		   Both Embedded drop-in HS and
  PowerPAC(TM) options are
  available for production
160 0.65 7.60 sq.- Cu
10.50 sq.- Cu
12.4 sq.- Cu		 2.25 - 7.00
5.15 - 10.0
7.05 - 11.90		 3.80
6.70
8.50		   Both Embedded drop-in HS and
  PowerPAC(TM) options are
  available for production
28 x 28 x 3.4mm
(2.60mm)		 208 0.50 7.30 sq.- Cu (3)
8.5 sq. - Cu
9.75 sq.- Cu
10.00 sq.- Cu (3)
12.00 sq. - Cu
14.50 sq.- Cu		 1.95 - 6.80
1.95 - 8.0
4.40 - 9.25
4.65 - 9.40
5.00 - 11.00
9.15 - 14.0
 3.50
3.50
5.90
6.20
7.00
10.70		   Both Embedded drop-in HS and
  PowerPAC(TM) options are
  available for production
256 0.40 10.06 sq.- Cu 4.70 - 9.55 6.20
32 x 32 x 3.4mm
(2.60mm)		 240 0.50 10.00 sq.- Cu
14.50 sq.- Cu		 4.65 - 9.50
9.15 - 14.0		 6.20
10.70		   Both Embedded drop-in HS and
  PowerPAC(TM) options are
  available for production
Notes:
(1) In case of ground bonds, reduce the maximum allowable die size by 0.50mm.
(2) Die pad pitch < 100 microns
(3) Suitable for both die-up or die-down assembly
 

TQFP/LQFP (Thin/Low Profile) Package Availability
Package x thickness
(Footprint)		 Lead Count Lead Pitch
(mm)		 Available Pad Size
(mm)		 Die size acceptable range(1)
(mm)		 Minimum acceptable die size(2)
(mm)		 Thermal package availability
7 x 7 x 1.4mm
(2.00mm)		 32 0.80 5.0 sq.- Cu 1.00 - 4.50 2.00  
48 0.50 5.0 sq.- Cu 1.00 - 4.50 2.00
10 x 10 x 1.0mm
(2.00mm)		 44 0.80 7.1 sq.- Cu 2.30 - 6.50 3.90  
64 0.50 7.1 sq.- Cu 2.30 - 6.50 3.90
10 x 10 x 1.4mm
(2.00mm)		 44 0.80 7.1 sq.- Cu 2.30 - 6.50 3.90  
64 0.50 7.1 sq.- Cu 2.30 - 6.50 3.90
10 x 10 x 2.0mm
(3.20/3.90mm)		 44 0.80 7.1 sq.- Cu 2.30 - 6.50 3.90  
64 0.50 7.1 sq.- Cu 2.30 - 6.50 3.90
14 x 14 x 1.4mm
(2.00mm)		 80 0.65 10.50 sq.- Cu 6.60 -9.90 7.40   Drop in Heat
  sink is available
100 0.50 7.00 sq.- Cu 3.10 - 6.40 3.90   Drop in Heat
  sink is available
120 0.40 7.00 sq.- Cu 3.10 - 6.40 3.80   Drop in Heat
  sink is available
128 0.40 9.50 sq.- Cu 5.50 - 8.90 6.30   Drop in Heat
  sink is available
14 x 14 x 2.0mm
(2.00mm)		 80 0.65 10.50 sq.- Cu 6.57 - 10.0 7.30  
100 0.50 7.00 sq.- Cu 3.00 - 6.50
 3.80
120 0.40 7.00 sq.- Cu 3.00 - 6.50 3.80
128 0.40 9.50 sq.- Cu 5.50 - 9.00 6.30
20 x 20 x 1.4mm
(3.20mm)		 144 0.50 7.00 sq.- Cu
11.00 sq.- Cu		 3.20 - 6.60
7.10 - 10.60		 4.90
7.90		  
24x 24x 1.4mm
(2.0mm)		 176 0.50 10.10 sq.- Cu
14.10 sq.- Cu		 6.10 - 9.60
10.10 - 13.60		 6.90
10.90		  
28 x 28 x 1.4mm
(2.00mm)		 160 0.65 10.00 sq.- Cu 6.60 - 9.50 6.80   Drop in Heat
  sink is available
208 0.50 10.00 sq.- Cu(3) 6.00 - 9.50 6.80
Notes:
(1) In case of ground bonds, reduce the maximum allowable die size by 1.0mm.
(2) Die pad pitch < 90 microns
(3) Suitable for both die- up or die-down assembly  
 


 
 
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