Quad Flat Package: Family
i2a Technologies provides a comprehensive family of QFP packaging solutions. From standard to low profile, thin and thermally enhanced packages are available to meet your applications.
Plastic Packages - Design - IC Assembly - Thermally Enhanced Packages
QFP (Quad-Flat-Package) is the original surface mount package family which addresses the higher leadcounts of larger digital ICs, owing to its design using thin, fine-pitch leadframes and four-sided lead configuration. Flexible external leads provide high reliability of solder joints of mounted devices while conventional wirebond and transfer molding result in low unit costs.
Variations within the package family include the low-profile and thin (LQFP and TQFP) type with package thicknesses of about 1.4mm and 1.0mm respectively. Thermally enhanced packages are available and include built-in heatsinks in standard QFPs and exposed die pads in L-and TQFPs, which can improve thermal dissipation between the chip and the package by over 50%.
i2a Technologies' QFP Families (MQFP, LQFP and TQFP) family of packages are wide ranging. The smallest package / lead count is 7x7 mm 32 leads and the largest package is 32x32mm 240 leads with the highest lead count being the 28x28mm 256 leads.
Custom Designs Are Easily Fabricated
Downloads
Download the Green Strategy (PDF)
Customer Request Form (XLSX)
Applications
- PC's
- Consumer Electronics
- Automotive
- Notebooks
- Disk Drives
- Cell Phones
A comprehensive range of Quad Flat Pack and Thin Outline package solutions.
Package Configurations
• TQFP - TQFP w/ Heat Sink
• LQFP – LQFP w/ Heat Sink
• MQFP – MQFP w/ Heat Sink
Cross-section illustration of QFP with drop-in (exposed) heatsink for enhanced thermal dissipation
MQFP (Metric) Package Availability
| Body Size x Thickness (+ Footprint) | Lead Count |
Lead Pitch (mm) |
Available Pad Size (mm) |
Die Size acceptable range (mm) |
Minimum acceptable die size (mm) |
Thermal package availability |
| 14 x 20 x 2.7mm (+3.2/3.9mm) | 80 | 0.8 | 6.60 sq. - Cu | 1.25 - 6.00 | 2.7 | PowerPAC™ or Drop-in Heatsink |
| 100 | 0.65 | 6.60 sq. - Cu | 1.25 - 6.00 | 2.7 | PowerPAC™ or Drop-in Heatsink | |
| 9.10 sq. - CU | 3.75 - 8.60 | |||||
| 128 | 0.5 | 7.00 sq. - CU | 1.65 - 6.50 | 3 | PowerPAC™ or Drop-in Heatsink | |
| 9.10 sq. - CU | 3.75 - 8.60 | 5.2 | ||||
| 11.00 sq. - CU | 5.65 - 10.40 | 7 | ||||
| 28 x 28 x 3.4mm (+3.2/3.9mm) | 128 | 0.8 | 10.50 sq. - Cu | 5.25 - 9.80 | 7 | PowerPAC™ or Drop-in Heatsink |
| 144 | 0.65 | 7.60 sq. - Cu | 2.25 - 7.00 | 3.8 | ||
| 10.00 sq. - Cu | 4.65 - 9.40 | 6.7 | ||||
| 160 | 0.65 | 7.60 sq. - Cu | 2.25 - 7.00 | 3.8 | ||
| 10.50 sq. - Cu | 5.15 - 10.0 | 6.7 | ||||
| 12.4 sq. - Cu | 7.05 - 11.90 | 8.5 | ||||
| 28 x 28 x 3.4mm (+2.60mm) | 208 | 0.5 | 7.30 sq. - Cu (3) | 1.95 - 6.80 | 3.5 | PowerPAC™ or Drop-in Heatsink |
| 8.5 sq. - Cu | 1.95 - 8.0 | 3.5 | ||||
| 9.75 sq. - Cu | 4.40 - 9.25 | 5.9 | ||||
| 10.00 sq. - Cu (3) | 4.65 - 9.40 | 6.2 | ||||
| 12.00 sq. - Cu | 5.00 - 11.00 | 7 | ||||
| 14.50 sq. - Cu | 9.15 - 14.0 | 10.7 | ||||
| 256 | 0.4 | 10.06 sq. - Cu | 4.70 - 9.55 | 6.2 | ||
| 32 x 32 x 3.4mm (+2.60mm) | 240 | 0.5 | 10.00 sq. - Cu | 4.65 - 9.50 | 6.2 | PowerPAC™ or Drop-in Heatsink |
| 14.50 sq. - Cu | 9.15 - 14.0 | 10.7 |
PowerPAC uses an internal heat spreader
TQFP/LQFP Package Availability
| Body Size x Thickness (+ Footprint) | Lead Count |
Lead Pitch (mm) |
Available Pad Size (mm) |
Die Size acceptable range (mm) |
Minimum acceptable die size (mm) |
Thermal package availability |
| 7 x 7 x 1.4mm (+2.0mm) | 32 | 0.8 | 5.0 sq. - Cu | 1.00 - 4.50 | 2 | |
| 48 | 0.5 | 5.0 sq. - Cu | 1.00 - 4.50 | 2 | ||
| 10 x 10 x 1.0mm (+2.0mm) | 44 | 44 | 7.1 sq. - Cu | 2.30 - 6.50 | 3.9 | |
| 64 | 0.5 | 7.1 sq. - Cu | 2.30 - 6.50 | 3.9 | ||
| 10 x 10 x 1.4mm (+2.0mm) | 44 | 0.8 | 7.1 sq. - Cu | 2.30 - 6.50 | 3.9 | |
| 64 | 0.5 | 7.1 sq. - Cu | 2.30 - 6.50 | 3.9 | ||
| 10 x 10 x 2.0mm (+3.2/3.9mm) | 44 | 0.8 | 7.1 sq. - Cu | 2.30 - 6.50 | 3.9 | |
| 64 | 0.5 | 7.1 Sq. - Cu | 2.30 - 6.50 | 3.9 | ||
| 14 x 14 x 1.4mm (+2.0mm) | 80 | 0.65 | 10.50 sq. - Cu | 6.60 - 9.90 | 7.4 | |
| 100 | 0.5 | 7.00 sq. - Cu | 3.10 - 6.40 | 3.9 | ||
| 120 | 0.4 | 7.00 sq. - Cu | 3.10 - 6.40 | 3.8 | ||
| 128 | 0.4 | 9.50 sq. - Cu | 5.50 - 8.90 | 6.3 | ||
| 14 x 14 x 2.0mm (+2.0mm) | 80 | 0.65 | 10.50 sq. - Cu | 6.57 - 10.0 | 7.3 | |
| 100 | 0.5 | 7.00 sq. - Cu | 3.00 - 6.50 | 3.8 | ||
| 120 | 0.4 | 7.00 sq. - Cu | 3.00 - 6.50 | 3.8 | ||
| 128 | 0.4 | 9.50 sq. - Cu | 5.50 - 9.00 | 6.3 | ||
| 20 x 20 x 1.4mm (+2.0mm) | 144 | 0.5 | 7.00 sq. - Cu | 3.20 - 6.60 | 4.9 | |
| 11.00 sq. - Cu | 7.10 - 10.60 | 7.9 | ||||
| 24 x 24 x 1.4mm (+2.0mm) | 176 | 0.5 | 10.10 sq.- Cu | 6.10 - 9.60 | 6.9 | |
| 14.10 sq. - Cu | 10.10 - 13.60 | 10.9 | ||||
| 28 x 28 x 1.4mm (+2.0mm) | 160 | 0.65 | 10.00 sq.- Cu | 6.60 - 9.50 | 6.8 | Drop-in Heatsink |
| 208 | 0.5 | 10.00 sq. - Cu | 6.00 - 9.50 | 6.8 |
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