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| I2A Technologies has the widest range of IC packaging options
of any domestic supplier at our Silicon Valley site, coupled with
larger-scale production in Malaysia. We also combine SMT
manufacturing with semiconductor
assembly. Standard offerings include QFN, QFP, BGA,
and FBGA families with a large choice of sizes, pin-counts and available
substrates. Flip-Chip assembly and traditional wirebonding are
both available. System-in-Package modules combining chips with
other electronic components are built to customer specifications.
Bumping and Wafer-Level CSP is offered using high-precision screen
printing which eliminates costly wafer fabrication steps. |
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