I2A Technologies
has developed the open-cavity package (OCP) solution to provide
standard packaging which allows access to the semiconductor die of
prototype ICs. OCP options include all QFP and BGA package
types and match the standard packages from those families.
OCP packaging is most often used
by development engineers to debug new products. Open access
to the actual chip within the package enables special inspection,
testing, micro-probing, and even repair using focused ion beam (FIB)
technology. Packages are fabricated in advance using
standard QFP and BGA molded leadframes or substrates and are
available for quick delivery of prototype ICs. Packages can be shipped with
removable metal lids to prevent damage to the delicate chip & wire
assembly during handling.
