MULTI CHIP MODULE - BALL GRID ARRAY

Overview

The need for high density, high performance, and cost effectiveness has sped up the development and use of multi-chip modules. Multi-chip modules enable the integration of different chips with varied functions into a mini substrate, instead of inserting individual packages onto a large PCB (also known as second level packages)

i2a's MCM-BGA (Multi-Chip Module Ball Grid Array) assembly employs the latest IC packaging technology for high-density products. MCM-BGA provides exceptional electrical and thermal performance coupled with its affordability enable system designers to integrate several devices into a single IC package.

Application

The integration of multiple semiconductor technologies into a single MCM-BGA package provides excellent advantages in instances where size, weight, electrical considerations are of highest priority. The high-speed performance and improved thermal capability of the MCM-BGA package is very suitable for a number of applications.

Features

• 27x27 mm to 40x40 mm organic/ceramic BGA as well as non JEDEC module systems- Full design capability
• Wire-bond, Flip Chip / WLP or combo, passives etc
• Lead free process if required
• High speed performance
• Good thermal performance
• Integrate different devices into one package
• Cost effective solution for high density package
• Eliminate the use of second level package
• Good electrical performance
• JEDEC standard compliant

Reliability
Package Level - MSL JEDEC Level 3 30¡¦C/ 60%RH, 192hrs

• PCT 121¡¦C/ 100%RH/ 2atm, 168hrs
• TCT ¡V65¡¦C ~ 150¡¦C, 1000 cycles
• HAST 130¡¦C/ 85%RH, 100hrs
• HTST 150¡¦C, 1000hr