The need for high density, high performance, and cost effectiveness has sped up the development and use of multi-chip modules. Multi-chip modules enable the integration of different chips with varied functions into a mini substrate, instead of inserting individual packages onto a large PCB (also known as second level packages)
i2a's MCM-BGA (Multi-Chip Module Ball Grid Array) assembly employs the latest IC packaging technology for high-density products. MCM-BGA provides exceptional electrical and thermal performance coupled with its affordability enable system designers to integrate several devices into a single IC package.
The integration of multiple semiconductor technologies into a single MCM-BGA package provides excellent advantages in instances where size, weight, electrical considerations are of highest priority. The high-speed performance and improved thermal capability of the MCM-BGA package is very suitable for a number of applications.
Package Level - MSL JEDEC Level 3 30¡¦C/ 60%RH, 192hrs
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