i2a Technologies provides IC packaging, system and module assembly, wafer bumping and related services.
i2a's substantial local facility with compliant systems and specs means you have a major source for production. For defense and government products that require domestic operations and controls, we meet ITAR regulations.
Some of the key offerings of i2a Technologies include volume production of IC Packaging. Package options available are BGA's, QFN's and QFP's. Additional chip packaging capabilities include Flip Chip Assembly, Wafer Level Packaging, Sip (System-in-Package) and Chip Scale Packaging. To compliment these services i2a Technologies provides module and board-level assemblies, package and product design as well as quick-turn prototyping. Engineering services include but are not limited to, Thermal and Electrical simulation, modeling and Failure Analysis.
Industry segments and applications include semiconductors, communications, medical devices, defense electronics, consumer electronics, computers and networking products. i2a's people have extensive experience providing outsourced manufacturing services to these industries, and they stand ready to exceed your expectations. World-class process, quality and business management systems make i2a a superior choice for large OEMs and high-tech startups alike.
Contact i2a Technologies today to learn how you can benefit from our capabilities.
i2a Technologies provides manufacturing services to the semiconductor and electronics industries, including: