Fine-pitch BGA packages are near chip-size versions of the
ball-grid array family, featuring smaller, thinner dimensions and
flexible body size and pincount availability. They are
assembled using shared tooling and common substrate panels allowing
new package sizes to be created with far less cost and lead-times
than conventional packaging. Their size and design provide low
signal inductance. The FBGA family also uses common package
assembly processes making it compatible with existing manufacturing
infrastructure.
FBGA packages are used for semiconductors such as SRAM, DRAM and
flash memory, logic, analog, RF devices and simple PLDs requiring a
smaller package size than conventional PBGAs. These packages are
found in mobile phones and pagers, notebook and subnotebook personal
computers, GPS transceivers, PDAs and wireless communications
devices.
I2A Technologies' FBGA
package family consists of package sizes from 5x5 mm to 17x17 mm in
lead counts from 25 to 256. The sizes listed below are for
existing available substrates, however virtually any size and lead
count within the range can be custom made by special order. We
provide design services and procure substrate fabrication, as well
as perform prototype and production assembly manufacturing.
