I2A Technologies' engineering services can help you custom design
and implement IC Packaging, System-in-Package, Stacked-Die
Packaging, Module and Wafer-Level CSP solutions to meet your
specific technology needs. Whether your company is considering
adopting an advanced packaging solution or is facing difficult
design challenges after the decision has been made, putting our
expertise to work can provide significant savings of time and money.
From package design, simulation and testing, to tooling and
equipment design, I2A's engineering team works closely with your
company or group at every stage of development of you advanced
packaging solution.
I2A's Design Project Flow:
- Specification/Netlist Review
- Package/SiP Draft Design
- Customer Confirmation
- Final Design
- Substrate Tooling and Fabrication
- Manufacturing Tooling and Fixtures
- Prototype Assembly and Testing
- Production Manufacturing
Package design demands have progressed from a simple interposer
to connect a semiconductor die to a printed circuit board to the
creation of a sub-system that is an electronically integral part of
the completed system. Signal integrity factors such as
controlled impedance, cross-talk, resistance and capacitance all
play an increasing role in successful package and SiP designs.
I2A Technologies' experience and understanding of these
technological issues and their solutions enables you to successfully
develop your high performance IC or SiP.
In addition to completed engineering projects, I2A Technologies
can provide professional services in any of the following areas to
assist you with your development activities:
Packaging Design Services
Evaluation of die to be packaged
Tape layout
Lead design
Tolerance analysis
Strip layouts
Outputs for tape
manufacturing
Cost Modeling
Drawings and documentation
Simulation and Modeling
Electrical
Mechanical
Thermal
Prototype and Pre-production Assembly
Prototype builds
Process enhancement and development
Tooling and fixture design
Materials evaluation
Reliability / Failure Analysis
Reliability testing (JEDEC pre-conditioning, temperature humidity,
autoclave, temperature cycle, high temperature storage )
SEM (Scanning Electron Microscopy)
Energy dispersive X-ray (elemental analysis)
X-ray radiographic
Acoustic microscopy
Optical microscopy
Cross-sectioning
Decapsulation
