Ball-grid array (BGA) packages are designed with output pins
arranged in a matrix of solder balls. The substrates of BGA packages
are typically fabricated on semiconductor-grade multi-layer "BT"
PC-board material. The entire area of substrate can be used to route
package interconnections through multiple layers.
The characteristics of BGAs allow for higher pincounts as well as
higher electrical and thermal performance. Advantages over 'leaded'
SMT packages include higher interconnect density, improved
manufacturability at the testing system levels (due to lack of
delicate package pins and easy solderability), and ability to manage
thermal and electrical properties. BGAs have the further
advantage of lower ground and power inductance by allowing
assignment of their connections to rings or nets providing a shorter
current path to the system.
BGAs are commonly used for graphics ICs, PLDs, DSPs, PC
chipsets, communications, networking, microprocessors/controllers,
ASIC, and other logic and mixed signal applications and are found in
all types of computers and electronic equipment.
I2A Technologies' plastic and metal BGA
package family consists of package sizes from 23x23 mm to 35x35 mm -
with custom designs up to 45x45 mm. The metal BGA is uses an
inverted 'cavity-down' structure with a copper heatsink built into
the substrate, cutting thermal resistance by half or more. We
provide design services and procure substrate fabrication, as well
as perform prototype and production assembly manufacturing.
