BGA Substrates - BGA Design - IC Assembly
Ball-grid array (BGA) packages are designed with output pins arranged in a matrix of solder balls. The substrates of BGA packages are typically fabricated on semiconductor-grade multi-layer "BT" PC-board material. The entire area of substrate can be used to route package interconnections through multiple layers.
The characteristics of BGAs allow for higher pincounts as well as higher electrical and thermal performance. Advantages over 'leaded' SMT packages include higher interconnect density, improved manufacturability at the testing system levels (due to lack of delicate package pins and easy solderability), and ability to manage thermal and electrical properties. BGAs have the further advantage of lower ground and power inductance by allowing assignment of their connections to rings or nets providing a shorter current path to the system.
BGAs are commonly used for graphics ICs, PLDs, DSPs, PC chipsets, communications, networking, microprocessors/controllers, ASIC, and other logic and mixed signal applications and are found in all types of computers and electronic equipment.
i2a Technologies' plastic and metal BGA package family consists of package sizes from 23x23 mm to 35x35 mm - with custom designs up to 45x45 mm. The metal BGA is uses an inverted 'cavity-down' structure with a copper heatsink built into the substrate, cutting thermal resistance by half or more. We provide substrate design engineering services and procure substrate fabrication, as well as perform prototype and production assembly manufacturing.
Custom Designs Are Easily Fabricated
|Pkg. Body Size (mm)||
Substrate Thickness (mm)
Package Thickness (mm)
Mold Cap Size (mm)
|23 x 23||204||0.36||2.13||19.5 x 19.5|
|27 x 27||225||0.36||2.13||24 x 24|
|31 x 31||308||0.56||2.33||26 x 26|
|35 x 35||352||0.56||2.33||30 x 30|
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