i2a Technologies specializes in the design, development and contract manufacturing of embedded microcontroller and other systems.  The company is one of the leading chip-on-board (COB) systems manufacturers worldwide combining SMT component assembly with IC wafer sawing and gold wirebonding.  Applications include medical device electronics, consumer products, computers and communications systems. 

By utilizing the latest technologies, most advanced equipment and highest quality standards, we provide core manufacturing services to include PCB build, box-build, final packing and delivery to end users. Using a single source supplier for all your manufacturing needs simplifies the whole process and allows you to concentrate on your core business.

Whether you are updating an existing product or introducing a new one, I2A Technologies has the ability to assist our manufacturing customers with their design and engineering requirements. We have extensive experience designing and building medical devices and consumer products.

Embedded software designing

Low power CPU applications
Short range inductive telemetry
Design of LCD based applications

PCB layout design

Schematic design
Prototype PCB Assembly
Analog and digital simulation
PCB layout with 2-layers

Mechanical design

Mold-Die Design
LCD Design
Casing Layout Design
Mechanical Parts Design

Ongoing Development

Manufacturing technology development
Tester design and development
Failure Analysis Capability up to die level.
Package reliability
Silicon design

Manufacturing Capabilities

Surface-Mount Technology (SMT)

Lead-free solder paste process
0402 capability
0201 capability with 0.15mm inter-component spacing.
01005 chip capability

Gold Wire Bonding

Chip-on-flex (COF)
Chip-on-chip (COC)
Chip-on-board (COB)
60um bond-pad-pitch (current)
Multiple-die bonding (6 dice on a board)
High wire density bonding (400 wires a board)

i2a Technologies •  3399 West Warren Ave.  •  Fremont, CA  94538  •  Tel: 510-770-0322  •  Fax: 510-770-0313  •  sales@ipac.com