QFP (Quad-Flat-Package) is the original surface mount package family which addresses the higher leadcounts of larger digital ICs, owing to its design using thin, fine-pitch leadframes and four-sided lead configuration. Flexible external leads provide high reliability of solder joints of mounted devices while conventional wirebond and transfer molding result in low unit costs.

Variations within the package family include the low-profile and thin (LQFP and TQFP) type with package thicknesses of about 1.4mm and 1.0mm respectively.  Thermal enhancements available include built-in heatsinks in standard QFPs and exposed die pads in L-and TQFPs, which can improve thermal dissipation between the chip and the package by over 50%.

QFPs are found in PCs, consumer electronics, automotive and industrial applications, wherever such IC products as processors, controllers, logic, ASICs, graphics, DAC and many others are used.   LQFPs and TQFPs are ideal for applications such as lightweight and portable electronic products, notebook PCs, disk drives, cell phones, etc.

i2a Technoloies' QFP Families (MQFP, LQFP and TQFP) family of packages are wide ranging. The smallest package / lead count is 7x7 mm 32 leads and the largest package is 32x32mm 240 leads with the highest lead count being the 28x28mm 256 leads.