|
Fine-pitch BGA packages are near chip-size versions of the ball-grid array family, featuring smaller, thinner dimensions and flexible body size and pincount availability. They are assembled using shared tooling and common substrate panels allowing new package sizes to be created with far less cost and lead-times than conventional packaging. Their size and design provide low signal inductance. The FBGA family also uses common package assembly processes making it compatible with existing manufacturing infrastructure.
FBGA packages are used for semiconductors such as SRAM, DRAM and flash memory, logic, analog, RF devices and simple PLDs requiring a smaller package size than conventional PBGAs. These packages are found in mobile phones and pagers, notebook and subnotebook personal computers, GPS transceivers, PDAs and wireless communications devices.
i2a Technologies' FBGA package family consists of package sizes from 5x5 mm to 17x17 mm in lead counts from 25 to 256. The sizes listed below are for existing available substrates, however virtually any size and lead count within the range can be custom made by special order. We provide design services and procure substrate fabrication, as well as perform prototype and production assembly manufacturing |
Typical FBGA Construction -- New Packages are Easily Fabricated
|
FBGA (Fine Pitch) Typical Package Configurations |
|
Package |
Dimension mm |
I/O |
Ball Pitch mm |
|
|
|
fpBGA >1.7mm |
10.16 X 11.43 |
36 |
1.27 |
|
9 X 11 |
24 |
1.27 |
|
|
|
fpBGA >1.7mm |
21 X 21 |
256, 316 |
1 |
|
23 X 23 |
484 |
1 |
|
25 X 25 |
529 |
1 |
|
27 X 27 |
672 |
1 |
|
35 X 35 |
388 |
1.27 |
|
|
|
fpBGA |
4 X 4 |
24 |
0.8 |
|
5 X 5 |
32, 36 |
0.5, 0.8 |
|
5.5 X 16 |
114 |
0.8 |
|
6 X 6 |
36, 48, 56 |
0.5, 0.8 |
|
6.0 X 5.35 |
26 |
0.65 |
|
6 X 9 |
48 |
0.8 |
|
7 X 7 |
48, 49, 64, 81, 100, 104 |
0.5, 0.65, 0.75, 0.8 |
|
7 X 8 |
48 |
0.75 |
|
7 X 12 |
48, 54 |
0.5, 0.75 |
|
8 X 8 |
64, 72, 80, 100 |
0.65, 0.8 |
|
8 X 9 |
48 |
0.8 |
|
9 X 9 |
64, 80, 100, 113 |
0.8, 1.0 |
|
10 X 10 |
100, 108, 109, 140, 144, 165, 296, 302 |
0.5, 0.8, 1.0 |
|
10 X 12 |
48 |
1 |
|
10 X 14 |
48, 117 |
1 |
|
11 X 11 |
64, 100, 169, 282, 355 |
0.5, 0.8, 1.0 |
|
12 X 12 |
121, 160, 168, 180, 196, 204, 276 |
0.65, 0.8, 1.0 |
|
12 X 7 |
47 |
0.5 |
|
12 X 16 |
130 |
0.8 |
| FBGA (Fine Pitch) Typical Package Configurations |
| Package |
Dimension mm |
I/O |
Ball Pitch mm |
| |
| fpBGA 1.7mm max |
13 X 13 |
132, 144, 160, 176, 200, 225, 256, 417, 515 |
0.5, 0.8, 1.0 |
| 13 X 10 |
48 |
1 |
| 15 X 15 |
176, 196, 208, 289, 301, 324, 448 |
0.65, 0.8, 1.0 |
| 17 X 17 |
192, 220, 256, 329 |
0.8, 1.0 |
| 19 X 19 |
324 |
1 |
| 21 X 21 |
256, 316, 400 |
1 |
| |
|
|
|
| T-fpBGA 1.2mm max |
4 X 4 |
49 |
0.5 |
| 5 X 5 |
41, 49, 52, 65 |
0.5, 0.65 |
| 5.7 X 5 |
25 |
0.75 |
| 6 X 6 |
56, 95, 96 |
0.5 |
| 7 X 7 |
48, 100, 144 |
0.5, 0.8 |
| 7 X 12 |
54 |
1 |
| 8 X 8 |
64, 100 |
0.5, 0.8 |
| 8 X 10 |
48 |
0.8 |
| 10 X 10 |
112, 164, 281, |
0.5 |
| 10 X 13 |
54, 64, 80 |
1 |
| 10.1 X 10.9 |
281 |
0.5 |
| 12 X 12 |
160 |
0.8 |
| 13 X 13 |
132 |
1 |
| Vt-fpBGA |
4.5 X 7 |
52 |
0.65 |
| 5 X 5 |
80 |
0.5 |
| 6 X 6 |
96 |
0.5 |
| 10 X 10 |
192 |
0.5 |
|
