Ball-grid array (BGA) packages are designed with output pins arranged in a matrix of solder balls. The substrates of BGA packages are typically fabricated on semiconductor-grade multi-layer "BT" PC-board material. The entire area of substrate can be used to route package interconnections through multiple layers.

The characteristics of BGAs allow for higher pincounts as well as higher electrical and thermal performance. Advantages over 'leaded' SMT packages include higher interconnect density, improved manufacturability at the testing system levels (due to lack of delicate package pins and easy solderability), and ability to manage thermal and electrical properties.  BGAs have the further advantage of lower ground and power inductance by allowing assignment of their connections to rings or nets providing a shorter current path to the system.

BGAs are commonly used for graphics ICs, PLDs, DSPs, PC chipsets, communications, networking, microprocessors/controllers, ASIC, and other logic and mixed signal applications and are found in all types of computers and electronic equipment.

 

PBGA Cross-Section Showing Wirebond -- Also Available with Flip-Chip Interconnect