i2a Technologies has the widest range of IC packaging options of any domestic supplier at our Silicon Valley site. We also combine SMT manufacturing with semiconductor assembly. Standard offerings include QFN, QFP, BGA, and FBGA families with a large choice of sizes, pin-counts and available substrates. Flip-Chip assembly and traditional wirebonding are both available. System-in-Package modules combining chips with other electronic components are built to customer specifications. Bumping and Wafer-Level CSP is offered using high-precision screen printing which eliminates costly wafer fabrication steps.