INNOVATIVE IC PACKAGING & ASSEMBLY TECHNOLOGIES

PROCESS / PRODUCTION CAPABILITIES OVERVIEW

i2a Technologies, a provider of miniaturization technologies for the electronics industry, enables improvements in miniaturization and performance by applying our expertise in the electrical, thermal and mechanical properties of materials and interconnect.

i2a develops and license technologies to the electronics industry. Its intellectual property, covers a broad range of advanced semiconductor packaging and interconnect solutions. i2a manufacturers products based on that technology as well as license our technology to others, enabling them to produce semiconductor chips that are smaller, faster, and incorporate more features. These semiconductors are utilized in a broad range of electronic products as well as markets (Medical, Mil-Aero, Aerospace, Communication, Automotive, Commercial etc), and can include, but not limited to, digital audio players, digital cameras, personal computers, personal digital assistants, video game consoles and mobile phones. By using i2a's technology and services, we believe that our customers are able to reduce the time-to-market and development costs of their semiconductors.

i2a's patented technology enables our customers to assemble semiconductor chips into chip-scale packages (CSP's), that are almost as small as the chip itself. Our technology also enables multiple chips to be stacked vertically in a single three-dimensional multi-chip package that occupies almost the same circuit board area as a CSP. This patented technology allows a plurality of semiconductor chips and passive components to be densely combined in ultra-compact electronics modules. By reducing the size of the semiconductor package and shortening electrical connections between the chip and the circuit board, our technology allows further miniaturization and increased performance and functionality of electronic products.

We achieve these benefits without sacrificing reliability by allowing movement within the package, thus addressing critical problems associated with thermally-induced stress which can occur when packages decrease in size.

i2a's Technologies also enable our customers to package semiconductor chips and micro-devices at the wafer level ("wafer level packaging" or "WLP") and to create high-density interconnections between electronic components using flexible substrate materials. i2a is principally engaged in assembly and development activities related to QFP, BGA, fpBGA, CSP, SIP, QFN, DFN, chip-scale, Wafer bumping, WLCSP, COC (chip on chip) and multi-chip packaging technology, using both wire-bonding as well as flip-chip interconnect technologies. We began manufacturing activities in 1993 to support market acceptance of our technology. We continue to help our customers develop new products , through our design and engineering services, initial production ramp up ( time to market volumes) as well as manufacture limited & medium volumes (250,000-300,000/week) of these products at our US based operation and high volumes at selected off shore facilities.