© 2013 i2a Technologies. All Rights Reserved.
3399 West Warren Avenue ¦ Fremont CA. 94538 ¦ Telephone: 510-770-0322 ¦ Fax: 510-770-0313 ¦ Email: email@example.com
i2A Technologies offers a range of assembly solutions to meet your IC Packaging needs utilizing wire bonding and wafer bumping technologies in a variety of package families.
I2a supports the following package technologies:
Wafer Grinding / Thinning
Fast Turn Assembly 24 hrs or LESS!
i2a Technologies makes no guarantee or warranty of its accuracy, or that the use of such information will not infringe upon the IP rights of third parties. i2a shall not be responsible for any loss or damage of whatever nature, resulting from the use of or reliance upon this information and no patent or other license is implied. This document does not in any way extend or modify i2a warranty on any product beyond that set forth in its standard terms and conditions of sale. i2a reserves the right to make changes in its product and specifications at any time and without notice.
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