Silicon Valley's resource for manufacturing.

I2A Technologies provides IC packaging, system and module assembly, wafer bumping and related services.

I2A's substantial local facility with compliant systems and specs means you have a major source for defense and government products that require domestic operations and controls, and we can meet ITAR regulations.

Some of the key offerings of I2A include volume production, a wide selection of IC package options (BGA, QFN, QFP), advanced packaging (CSP, Flip-Chip, WLP, SiP), modules and board-level assemblies, package and product design, and quick-turn prototyping.  Industry segments and applications include semiconductors, communications, medical devices, defense electronics, consumer electronics, computers and networking products.  I2A's people have extensive experience providing outsourced manufacturing services to these industries, and they stand ready to exceed your expectations.  World-class process, quality and business management systems make I2A a superior choice for large OEMs and high-tech startups alike.

Contact I2A Technologies today to learn how you can benefit from our capabilities.